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Coverslip Filling
Liquid deposition
Principle.  Liquid is rapidly pushed into wells by means of sliding a coverslip across the surface. By applying pressure onto the coverslip in verticle direction, the liquid take-up between coverslip and substrate is minimized resulting in "bonding" of coverslip and substrate. This prevents evaporation of the liquid from the wells for hours up to days.
-  Assays
-  Chemical reactions
-  Crystallization
-  Bacterial- and cell growth
Coverslip Filling
CoverslipFilling (The filling action is shown from the side and from the front). Etched wells on a microarray are filled with an aquaous solution by moving a glass coverslip and liquid across the wells. The filling speed is low (1 mm/s) to show the filling principle in detail.